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Solderability testing of 95.5Sn-3.9Ag-0.6Cu solder on oxygen-free high-conductivity copper and Au-Ni-Plated kovar
Edwin P. Lopez, Paul T. Vianco, Jerome A. RejentVolume:
32
Year:
2003
Language:
english
Pages:
7
DOI:
10.1007/s11664-003-0218-8
File:
PDF, 288 KB
english, 2003