The effect of microstructural and geometrical features on the reliability of ultrafine flip chip microsolder joints
Zhiheng Huang, Paul P. Conway, Changqing Liu, Rachel C. ThomsonVolume:
33
Year:
2004
Language:
english
Pages:
9
DOI:
10.1007/s11664-004-0126-6
File:
PDF, 762 KB
english, 2004