![](/img/cover-not-exists.png)
Thermosonic bonding of gold wire onto a copper pad with titanium thin-film deposition
Jong-Ning Aoh, Cheng-Li ChuangVolume:
33
Year:
2004
Language:
english
Pages:
10
DOI:
10.1007/s11664-004-0135-5
File:
PDF, 501 KB
english, 2004