Development of a thermosonic wire-bonding process for gold...

Development of a thermosonic wire-bonding process for gold wire bonding to copper pads using argon shielding

Jong-Ning Aoh, Cheng-Li Chuang
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Volume:
33
Year:
2004
Language:
english
Pages:
12
DOI:
10.1007/s11664-004-0136-4
File:
PDF, 506 KB
english, 2004
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