![](/img/cover-not-exists.png)
Development of a thermosonic wire-bonding process for gold wire bonding to copper pads using argon shielding
Jong-Ning Aoh, Cheng-Li ChuangVolume:
33
Year:
2004
Language:
english
Pages:
12
DOI:
10.1007/s11664-004-0136-4
File:
PDF, 506 KB
english, 2004