Effect of silver content on the shear fatigue properties of Sn-Ag-Cu flip-chip interconnects
Yoshiharu Kariya, Takuya Hosoi, Shinichi Terashima, Masamoto Tanaka, Masahisa OtsukaVolume:
33
Year:
2004
Language:
english
Pages:
8
DOI:
10.1007/s11664-004-0138-2
File:
PDF, 579 KB
english, 2004