Creep behavior of the ternary 95.5Sn-3.9Ag-0.6Cu solder—Part I: As-cast condition
Paul T. Vianco, Jerome A. Rejent, Alice C. KilgoVolume:
33
Year:
2004
Language:
english
Pages:
12
DOI:
10.1007/s11664-004-0169-8
File:
PDF, 1.58 MB
english, 2004