![](/img/cover-not-exists.png)
Effects of different printed-circuit-board surface finishes on the formation and growth of intermetallics at thermomechanically fatigued, small outline J leads/Sn-Ag-Cu interfaces
Pei-Lin Wu, Meng-Kuang Huang, Chiapyng Lee, Shyh-Rong TzanVolume:
33
Year:
2004
Language:
english
Pages:
5
DOI:
10.1007/s11664-004-0174-y
File:
PDF, 307 KB
english, 2004