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Process windows for low-temperature Au wire bonding
Yu Hin Chan, Jang-Kyo Kim, Deming Liu, Peter C. K. Liu, Yiu Ming Cheung, Ming Wai NgVolume:
33
Year:
2004
Language:
english
Pages:
10
DOI:
10.1007/s11664-004-0285-5
File:
PDF, 538 KB
english, 2004