The interfacial reaction between Sn-Zn-Ag-Ga-Al solders and metallized Cu substrates
Chiang-Ming Chuang, Hui-Tzu Hung, Pei-Chi Liu, Kwang-Lung LinVolume:
33
Year:
2004
Language:
english
Pages:
7
DOI:
10.1007/s11664-004-0287-3
File:
PDF, 686 KB
english, 2004