![](/img/cover-not-exists.png)
Three-dimensional simulation of microstructure evolution in damascene interconnects: Effect of overburden thickness
Jung-Kyu Jung, Nong-Moon Hwang, Young-Joon Park, Young-Chang JooVolume:
34
Year:
2005
Language:
english
Pages:
5
DOI:
10.1007/s11664-005-0065-x
File:
PDF, 322 KB
english, 2005