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Solder/Substrate Interfacial Reactions in the Sn-Cu-Ni Interconnection System
H. Yu, V. Vuorinen, J. K. KivilahtiVolume:
36
Language:
english
Pages:
11
DOI:
10.1007/s11664-006-0028-x
Date:
February, 2007
File:
PDF, 538 KB
english, 2007