![](/img/cover-not-exists.png)
Three-dimensional analysis of the interface between an Sn-8wt.%Zn-3wt.%Bi solder and a substrate by using an angle-lapping method
Nobuhiro Ishikawa, Takashi Kimura, Kenji Nishida, Takeshi Aoyagi, Kazuo Furuya, Takashi SugizakiVolume:
35
Year:
2006
Language:
english
Pages:
6
DOI:
10.1007/s11664-006-0145-6
File:
PDF, 486 KB
english, 2006