Microstructure, creep properties, and failure mechanism of...

Microstructure, creep properties, and failure mechanism of SnAgCu solder joints

Janne J. Sundelin, Sami T. Nurmi, Toivo K. Lepistö, Eero O. Ristolainen
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Volume:
35
Year:
2006
Language:
english
Pages:
7
DOI:
10.1007/s11664-006-0154-5
File:
PDF, 341 KB
english, 2006
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