Microstructure, creep properties, and failure mechanism of SnAgCu solder joints
Janne J. Sundelin, Sami T. Nurmi, Toivo K. Lepistö, Eero O. RistolainenVolume:
35
Year:
2006
Language:
english
Pages:
7
DOI:
10.1007/s11664-006-0154-5
File:
PDF, 341 KB
english, 2006