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Depressing effect of 0.2wt.%Zn addition into Sn-3.0Ag-0.5Cu solder alloy on the intermetallic growth with Cu substrate during isothermal aging
Feng-Jiang Wang, Feng Gao, Xin Ma, Yi-Yu QianVolume:
35
Year:
2006
Language:
english
Pages:
7
DOI:
10.1007/s11664-006-0163-4
File:
PDF, 280 KB
english, 2006