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Thermosonic bonding of gold wire onto silver bonding layer on the bond pads of chips with copper interconnects
Cheng-Li Chuang, Jong-Ning AohVolume:
35
Year:
2006
Language:
english
Pages:
8
DOI:
10.1007/s11664-006-0220-z
File:
PDF, 341 KB
english, 2006