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A Preliminary Electron Backscatter Diffraction Study of Microstructures and Microtextures Evolution during Au Stud and Flip Chip Thermosonic Bonding
Chun-Mei Li, Ping Yang, De-Ming Liu, Ngar-Chun Hung, Ming LiVolume:
36
Language:
english
Pages:
6
DOI:
10.1007/s11664-007-0108-6
Date:
May, 2007
File:
PDF, 464 KB
english, 2007