Electroless Ni/Au Bump on a Copper Patterned Wafer for the...

Journal of Electronic Materials 2007 / 07 Vol. 36; Iss. 7

Electroless Ni/Au Bump on a Copper Patterned Wafer for the CMOS Image Sensor Package in Mobile Phones

Joong-Do Kim
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Volume:
36
Language:
english
Pages:
8
DOI:
10.1007/s11664-007-0144-2
Date:
July, 2007
File:
PDF, 485 KB
english, 2007
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