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Enhanced Wettability of Oxidized Copper with Lead-Free Solder by Ar-H2Plasmas for Flip-Chip Bumping
Yung-Sen Lin, Chun-Hao Chang, Wei-Jhih LinVolume:
36
Language:
english
Pages:
6
DOI:
10.1007/s11664-007-0225-2
Date:
November, 2007
File:
PDF, 343 KB
english, 2007