Cross-Interaction between Ni and Cu across Sn Layers with...

Journal of Electronic Materials 2007 / 11 Vol. 36; Iss. 11

Cross-Interaction between Ni and Cu across Sn Layers with Different Thickness

Chien Wei Chang, Su Chun Yang, Chun-Te Tu, C. Robert Kao
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Volume:
36
Language:
english
Pages:
7
DOI:
10.1007/s11664-007-0235-0
Date:
November, 2007
File:
PDF, 547 KB
english, 2007
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