Interfacial Reactions of Sn-8wt.%Zn-3wt.%Bi Solder with Cu,...

Journal of Electronic Materials 2007 / 11 Vol. 36; Iss. 11

Interfacial Reactions of Sn-8wt.%Zn-3wt.%Bi Solder with Cu, Ag, and Ni Substrates

Ching-Feng Yang, Sinn-Wen Chen, Kuan-Hsien Wu, Tsung-Shune Chin
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Volume:
36
Language:
english
Pages:
7
DOI:
10.1007/s11664-007-0255-9
Date:
November, 2007
File:
PDF, 632 KB
english, 2007
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