Demonstration and Characterization of Sn-3.0Ag-0.5Cu/ Sn-57Bi-1Ag Combination Solder for 3-D Multistack Packaging
Yun-Hwan Jo, Joo Won Lee, Sun-Kyoung Seo, Hyuck Mo Lee, Hun Han, Dong Chun LeeVolume:
37
Language:
english
Pages:
8
DOI:
10.1007/s11664-007-0296-0
Date:
January, 2008
File:
PDF, 736 KB
english, 2008