Microstructure and Creep Deformation of Sn-Ag-Cu-Bi/Cu Solder Joints
Min He, Sylvester N. Ekpenuma, Viola L. AcoffVolume:
37
Language:
english
Pages:
7
DOI:
10.1007/s11664-007-0368-1
Date:
March, 2008
File:
PDF, 901 KB
english, 2008