Calibration of Electromigration Reliability of Flip-Chip Packages by Electrothermal Coupling Analysis
Yi-Shao Lai, Chin-Li KaoVolume:
37
Language:
english
Pages:
1
DOI:
10.1007/s11664-007-0374-3
Date:
June, 2008
File:
PDF, 101 KB
english, 2008