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Joint Strength and Microstructure for Sn-Ag-(Cu) Soldering on an Electroless Ni-Au Surface Finish by Using a Flux Containing a Cu Compound
Seishi Kumamoto, Hitoshi Sakurai, Youichi Kukimoto, Katsuaki SuganumaVolume:
37
Language:
english
Pages:
9
DOI:
10.1007/s11664-008-0408-5
Date:
June, 2008
File:
PDF, 1.01 MB
english, 2008