Effect of Pulse-Plated Nickel Barriers on Tin Whisker...

Journal of Electronic Materials 2008 / 06 Vol. 37; Iss. 6

Effect of Pulse-Plated Nickel Barriers on Tin Whisker Growth for Pure Tin Solder Joints

Min-Na Chen, Shi-Jin Ding, Qing-Qing Sun, David Wei Zhang, Li-Kang Wang
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Volume:
37
Language:
english
Pages:
7
DOI:
10.1007/s11664-008-0412-9
Date:
June, 2008
File:
PDF, 696 KB
english, 2008
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