Intermetallics Characterization of Lead-Free Solder Joints...

Journal of Electronic Materials 2008 / 08 Vol. 37; Iss. 8

Intermetallics Characterization of Lead-Free Solder Joints under Isothermal Aging

Anupam Choubey, Hao Yu, Michael Osterman, Michael Pecht, Fu Yun, Li Yonghong, Xu Ming
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Volume:
37
Language:
english
Pages:
9
DOI:
10.1007/s11664-008-0466-8
Date:
August, 2008
File:
PDF, 865 KB
english, 2008
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