Electromigration Reliability and Morphologies of Cu Pillar...

Journal of Electronic Materials 2008 / 10 Vol. 37; Iss. 10

Electromigration Reliability and Morphologies of Cu Pillar Flip-Chip Solder Joints with Cu Substrate Pad Metallization

Yi-Shao Lai, Ying-Ta Chiu, Jiunn Chen
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
37
Language:
english
Pages:
7
DOI:
10.1007/s11664-008-0515-3
Date:
October, 2008
File:
PDF, 639 KB
english, 2008
Conversion to is in progress
Conversion to is failed