A Hermetic Seal Using Composite Thin-Film In/Sn Solder as...

Journal of Electronic Materials 2009 / 01 Vol. 38; Iss. 1

A Hermetic Seal Using Composite Thin-Film In/Sn Solder as an Intermediate Layer and Its Interdiffusion Reaction with Cu

Li-ling Yan, Cheng-kuo Lee, Da-quan Yu, Ai-bin Yu, Won-Kyoung Choi, John-H Lau, Seung-Uk Yoon
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Volume:
38
Language:
english
Pages:
8
DOI:
10.1007/s11664-008-0561-x
Date:
January, 2009
File:
PDF, 578 KB
english, 2009
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