Evaluation of the Thermal Comfort of a Thermoelectric...

Journal of Electronic Materials 2009 / 07 Vol. 38; Iss. 7

Evaluation of the Thermal Comfort of a Thermoelectric Ceiling Cooling Panel (TE-CCP) System

Charoenporn Lertsatitthanakorn, Lamul Wiset, Surat Atthajariyakul
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Volume:
38
Language:
english
Pages:
6
DOI:
10.1007/s11664-008-0637-7
Date:
July, 2009
File:
PDF, 386 KB
english, 2009
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