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The Interaction Between an Imposed Current and the Creep of Idealized Sn-Ag-Cu Solder Interconnects
Christopher Kinney, Tae-Kyu Lee, Kuo-Chuan Liu, J. W. MorrisVolume:
38
Language:
english
Pages:
7
DOI:
10.1007/s11664-009-0851-y
Date:
December, 2009
File:
PDF, 319 KB
english, 2009