Abnormal Failure Behavior of Sn-3.5Ag Solder Bumps Under Excessive Electric Current Stressing Conditions
Jang-Hee Lee, Young-Bae ParkVolume:
38
Language:
english
Pages:
7
DOI:
10.1007/s11664-009-0855-7
Date:
October, 2009
File:
PDF, 678 KB
english, 2009