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Microstructure, Intermetallic Growth, and Reliability of Rapidly Solidified Pb-Free Solder Joints Formed via Solder Ball Jetting
John L. Wagner, Peter F. Ladwig, Doug P. Riemer, Galen HoukVolume:
38
Language:
english
Pages:
10
DOI:
10.1007/s11664-009-0881-5
Date:
December, 2009
File:
PDF, 735 KB
english, 2009