Microstructural Evolution of Sn-Ag-Sb Solder with Indium...

Journal of Electronic Materials 2009 / 10 Vol. 38; Iss. 10

Microstructural Evolution of Sn-Ag-Sb Solder with Indium Additions

Hwa-Teng Lee, Choo-Yeow Lee, Fok-Foo Lee, Yin-Fa Chen, Yang-Hsien Lee
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Volume:
38
Language:
english
Pages:
10
DOI:
10.1007/s11664-009-0884-2
Date:
October, 2009
File:
PDF, 1.13 MB
english, 2009
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