Effect of Electromigration and Isothermal Aging on the...

Journal of Electronic Materials 2009 / 12 Vol. 38; Iss. 12

Effect of Electromigration and Isothermal Aging on the Formation of Metal Whiskers and Hillocks in Eutectic Sn-Bi Solder Joints and Reaction Films

Fu Guo, Guangchen Xu, Hongwen He, Mengke Zhao, Jia Sun, C. Henry Wang
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Volume:
38
Language:
english
Pages:
12
DOI:
10.1007/s11664-009-0910-4
Date:
December, 2009
File:
PDF, 1.26 MB
english, 2009
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