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Effect of Wet Pretreatment on Interfacial Adhesion Energy of Cu-Cu Thermocompression Bond for 3D IC Packages
Eun-Jung Jang, Seungmin Hyun, Hak-Joo Lee, Young-Bae ParkVolume:
38
Language:
english
Pages:
6
DOI:
10.1007/s11664-009-0942-9
Date:
December, 2009
File:
PDF, 439 KB
english, 2009