Resistance Changes in Eutectic Sn-Bi Solder Joints During...

Journal of Electronic Materials 2009 / 12 Vol. 38; Iss. 12

Resistance Changes in Eutectic Sn-Bi Solder Joints During Electromigration

Fu Guo, Guangchen Xu, Jia Sun, Zhidong Xia, Yongping Lei, Yaowu Shi, Xiaoyan Li
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Volume:
38
Language:
english
Pages:
6
DOI:
10.1007/s11664-009-0944-7
Date:
December, 2009
File:
PDF, 451 KB
english, 2009
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