Compression Stress–Strain Behavior of Sn-Ag-Cu Solders

Compression Stress–Strain Behavior of Sn-Ag-Cu Solders

Edwin P. Lopez, Paul T. Vianco, Jerome A. Rejent, Carly George, Alice Kilgo
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Volume:
39
Language:
english
Pages:
8
DOI:
10.1007/s11664-009-0968-z
Date:
January, 2010
File:
PDF, 743 KB
english, 2010
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