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Effects of Zn-Containing Flux on Sn-3.5Ag Soldering with an Electroless Ni-P/Au Surface Finish: Microstructure and Wettability
Hitoshi Sakurai, Alongheng Baated, Kiju Lee, Seongjun Kim, Keun-Soo Kim, Youichi Kukimoto, Seishi Kumamoto, Katsuaki SuganumaVolume:
39
Language:
english
Pages:
7
DOI:
10.1007/s11664-010-1344-8
Date:
December, 2010
File:
PDF, 493 KB
english, 2010