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Sn-Ag-Cu Solder Joint Microstructure and Orientation Evolution as a Function of Position and Thermal Cycles in Ball Grid Arrays Using Orientation Imaging Microscopy
Tae-Kyu Lee, Bite Zhou, Lauren Blair, Kuo-Chuan Liu, Thomas R. BielerVolume:
39
Language:
english
Pages:
10
DOI:
10.1007/s11664-010-1348-4
Date:
December, 2010
File:
PDF, 1.49 MB
english, 2010