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Impact of Isothermal Aging on Long-Term Reliability of Fine-Pitch Ball Grid Array Packages with Sn-Ag-Cu Solder Interconnects: Surface Finish Effects
Tae-Kyu Lee, Hongtao Ma, Kuo-Chuan Liu, Jie XueVolume:
39
Language:
english
Pages:
10
DOI:
10.1007/s11664-010-1352-8
Date:
December, 2010
File:
PDF, 1.05 MB
english, 2010