Crack Development in a Low-Stress PBGA Package due to...

Crack Development in a Low-Stress PBGA Package due to Continuous Recrystallization Leading to Formation of Orientations with [001] Parallel to the Interface

Bite Zhou, Thomas R. Bieler, Tae-kyu Lee, Kuo-Chuan Liu
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Volume:
39
Language:
english
Pages:
11
DOI:
10.1007/s11664-010-1380-4
Date:
December, 2010
File:
PDF, 1.50 MB
english, 2010
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