Low-Temperature III–V Direct Wafer Bonding Surface Preparation Using a UV-Sulfur Process
Michael J. Jackson, Li-Min Chen, Ankit Kumar, Yang Yang, Mark S. GoorskyVolume:
40
Language:
english
Pages:
5
DOI:
10.1007/s11664-010-1397-8
Date:
January, 2011
File:
PDF, 288 KB
english, 2011