Interface Formation in the US-Wedge/Wedge-Bond Process of AlSi1/CuNiAu Contacts
Ute Geissler, Jürgen Funck, Martin Schneider-Ramelow, Hans-Jürgen Engelmann, Ingrid Rooch, Wolfgang H. Müller, Herbert ReichlVolume:
40
Language:
english
Pages:
8
DOI:
10.1007/s11664-010-1439-2
Date:
February, 2011
File:
PDF, 485 KB
english, 2011