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Interface Formation in the US-Wedge/Wedge-Bond Process of...

Interface Formation in the US-Wedge/Wedge-Bond Process of AlSi1/CuNiAu Contacts

Ute Geissler, Jürgen Funck, Martin Schneider-Ramelow, Hans-Jürgen Engelmann, Ingrid Rooch, Wolfgang H. Müller, Herbert Reichl
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Volume:
40
Language:
english
Pages:
8
DOI:
10.1007/s11664-010-1439-2
Date:
February, 2011
File:
PDF, 485 KB
english, 2011
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