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An Investigation of Diffusion Barrier Characteristics of an Electroless Co(W,P) Layer to Lead-Free SnBi Solder
Hung-Chun Pan, Tsung-Eong HsiehVolume:
40
Language:
english
Pages:
10
DOI:
10.1007/s11664-010-1488-6
Date:
March, 2011
File:
PDF, 920 KB
english, 2011