A Study of Difference in Reflow Characteristics Between...

Journal of Electronic Materials 2011 / 06 Vol. 40; Iss. 6

A Study of Difference in Reflow Characteristics Between Electroplated and Sputtered Cu in a Dual-Damascene Fabrication Process for Silicon Semiconductor Devices

Takashi Onishi, Masao Mizuno, Takao Fujikawa, Tetsuya Yoshikawa, Jun Munemasa, Masataka Mizuno, Teruo Kihara, Hideki Araki, Yasuharu Shirai
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Volume:
40
Language:
english
Pages:
10
DOI:
10.1007/s11664-011-1521-4
Date:
June, 2011
File:
PDF, 640 KB
english, 2011
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