Thermal Stress Analysis and Structure Parameter Selection...

Journal of Electronic Materials 2011 / 05 Vol. 40; Iss. 5

Thermal Stress Analysis and Structure Parameter Selection for a Bi2Te3-Based Thermoelectric Module

Jun-Ling Gao, Qun-Gui Du, Xiao-Dan Zhang, Xin-Qiang Jiang
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Volume:
40
Language:
english
Pages:
5
DOI:
10.1007/s11664-011-1611-3
Date:
May, 2011
File:
PDF, 545 KB
english, 2011
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