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Correlation Between Sn Grain Orientation and Corrosion in Sn-Ag-Cu Solder Interconnects
Tae-Kyu Lee, Bo Liu, Bite Zhou, Thomas Bieler, Kuo-Chuan LiuVolume:
40
Language:
english
Pages:
8
DOI:
10.1007/s11664-011-1654-5
Date:
September, 2011
File:
PDF, 1002 KB
english, 2011