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Impact of Isothermal Aging on Long-Term Reliability of Fine-Pitch Ball Grid Array Packages with Sn-Ag-Cu Solder Interconnects: Die Size Effects
Tae-Kyu Lee, Weidong Xie, Bite Zhou, Thomas Bieler, Kuo-Chuan LiuVolume:
40
Language:
english
Pages:
10
DOI:
10.1007/s11664-011-1702-1
Date:
September, 2011
File:
PDF, 1.62 MB
english, 2011