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Impact of 5% NaCl Salt Spray Pretreatment on the Long-Term Reliability of Wafer-Level Packages with Sn-Pb and Sn-Ag-Cu Solder Interconnects
Bo Liu, Tae-Kyu Lee, Kuo-Chuan LiuVolume:
40
Language:
english
Pages:
8
DOI:
10.1007/s11664-011-1705-y
Date:
October, 2011
File:
PDF, 769 KB
english, 2011