Impact of 5% NaCl Salt Spray Pretreatment on the Long-Term...

Journal of Electronic Materials 2011 / 10 Vol. 40; Iss. 10

Impact of 5% NaCl Salt Spray Pretreatment on the Long-Term Reliability of Wafer-Level Packages with Sn-Pb and Sn-Ag-Cu Solder Interconnects

Bo Liu, Tae-Kyu Lee, Kuo-Chuan Liu
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
40
Language:
english
Pages:
8
DOI:
10.1007/s11664-011-1705-y
Date:
October, 2011
File:
PDF, 769 KB
english, 2011
Conversion to is in progress
Conversion to is failed