Effect of Gold Content on the Microstructural Evolution of...

Journal of Electronic Materials 2012 / 02 Vol. 41; Iss. 2

Effect of Gold Content on the Microstructural Evolution of SAC305 Solder Joints Under Isothermal Aging

Mike Powers, Jianbiao Pan, Julie Silk, Patrick Hyland
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Volume:
41
Language:
english
Pages:
8
DOI:
10.1007/s11664-011-1744-4
Date:
February, 2012
File:
PDF, 815 KB
english, 2012
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